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³ª³ëź¼ÒŽħ High Aspect Ratio

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Extreme Aspect Ratio

High Aspect Ratio

Spike small and sharp

MCNT

 

 

 

 

Enhanced Resolution

Fast Scanning

3D CD Metrokogy

EBD-TESPA AFM Probes

 

 

 

 

High Resolution AFM Probes

Life Science

Nanoindentation

 

 


 

 

 

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°í¼º´É ³ª³ë°á°¢ÃøÁ¤À» AFM ±¸Çü Žħ

 

Á¤·Ä¼±ÀÌ ÀÖ´Â Chip, ±Ý ÇǺ¹ÀÌ µÇ¾î ÀÖ´Â Cantilever, ±¸¸éÀÇ Åº¼ÒtipÀ¸·Î ±¸¼º

 

 

 

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High Aspect Ratio ź¼ÒŽħ »ç¾ç

 

M1-HAR

M1-ESD

M-CIS

MC9070

Material

HDC/DLC

HDC/DLC

HDC/DLC

HDC/DLC

Shape

conical

conical

conical

post-like

Tip length / l

800nm

800nm

400nm

800nm

Diameter / d

70nm

75nm

n/a

55nm

Half cone angle

<3 degrees

<3 degrees

<4 degrees

<0 degrees

Radius / r

<5nm

<8nm

<10nm

<5nm

Tilt compensation

13 degrees

13 degrees

13 degrees

3 degrees

Pyramid height / PH

15um

15um

15um

15um

Tip set back / TSB

15um

15um

15um

5.2um

Cantilever Parameter

 

 

 

Material

Si

Si

Si

Si

Shape

NT-RTESPA

NT-RTESPA

NT-RTESPA

ArrowNCR

Length

120um

120um

120um

160um

Width

30um

30um

30um

45um

Thickness

4.4um

4.4um

4.4um

4.6um

Force constant

40N/m

40N/m

40N/m

42N/m

Resonance frequency

320kHz

320kHz

320kHz

260kHz

Tip side coating

none

none

none

none

Back side coating

none

none

none

reflex

Chip Parameter

 

 

 

 

Length

3400um

3400um

3400um

3400um

Width

1600um

1600um

1600um

1600um

Thickness

315um

315um

315um

315um

Alignment grooves

no

no

no

no

 

 

 

 


ITB CORPORATION

 

website : www.itbco.co.kr

email : sales@itbco.co.kr

tel : 02-549-8501